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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
3 Bit Scannable Registered Bus Transceiver
The MC10E/100E337 is a 3-bit registered bus transceiver with scan. The bus outputs (BUS0-BUS2) are specified for driving a 25 bus; the receive outputs (Q0 - Q2) are specified for 50. The bus outputs feature a normal HIGH level (VOH) and a cutoff LOW level -- when LOW, the outputs go to - 2.0V and the output emitter-follower is "off", presenting a high impedance to the bus. The bus outputs also feature edge slow-down capacitors.
MC10E337 MC100E337
3-BIT SCANNABLE REGISTERED BUS TRANSCEIVER
* * * * * * * * * * * *
Scannable Version of E336 25 Cutoff Bus Outputs 50 Receiver Outputs Scannable Registers Sync. and Async. Bus Enables Non-inverting Data Path 1500ps Max. Clock to Bus (Data Transmit) 1000ps Max. Clock to Q (Data Receive) Bus Outputs Feature Internal Edge Slow-Down Capacitors Additional Package Ground Pins Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors
FN SUFFIX PLASTIC PACKAGE CASE 776-02
Both drive and receive sides feature the same logic, including a loopback path to hold data. The HOLD/LOAD function is controlled by Transmit Enable (TEN) and Receive Enable (REN) on the transmit and receive sides respectively, with a HIGH selecting LOAD. Note that the implementation of the E337 Receive Enable differs from that of the E336. A synchronous bus enable (SBUSEN) is provided for normal, non-scan operation. The asynchronous bus disable (ABUSDIS) disables the bus immediately for scan mode. The SYNCEN input is provided for flexibility when re-enabling the bus after disabling with ABUSDIS, allowing either synchronous or asynchronous re-enabling. An alternative use is asynchronous-only operation with ABUSDIS, in which case SYNCEN is tied LOW, or left open. SYNCEN is implemented as an overriding SET control (active-LOW) to the enable flip-flop. Scan mode is selected by a HIGH at the SCAN input. Scan input data is shifted in through S_IN and output data appears at the Q2 output. All registers are clocked on the positive transition of CLK. Additional lead-frame grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins are not electrically connected to the chip. PIN NAMES
Pin A0 - A2 B0 - B2 S-IN TEN, REN SCAN ABUSDIS SBUSEN SYNCEN CLK BUS0 - BUS2 Q0 - Q2 Function Data Inputs A Data Inputs B Serial (Scan) Data Input HOLD/LOAD Controls Scan Control Asynchronous Bus Disable Synchronous Bus Enable Synchronous Enable Control Clock 25 Cutoff Bus Outputs Receive Data Outputs (Q2 serves as SCAN_OUT in scan mode)
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E337 MC100E337
Pinout: 28-Lead PLCC (Top View)
SBUSEN SYNCEN B0 25 SCAN S-IN TEN VEE REN CLK A1 26 27 28 1 2 3 4 5 B1 6 A2 7 B2 8 9 10 11 Q2 24 23 A0 ABUSDIS VCCO Q0 22 21 20 19 18 17 16 15 14 13 12 GND BUS0 VCC Q1 VCCO BUS1 GND
VCCO BUS2 GND
* All VCC and VCCO pins are tied together on the die.
LOGIC DIAGRAM
BUS2 Q2/ SCAN_OUT
A2 B2
DQ
DQ
BUS1
A1 B1
DQ
DQ
Q1
BUS0 Q0
A0 B0 S_IN TEN REN SCAN ABUSDIS SBUSEN SYNCEN CLK
DQ
DQ
DQ SET
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E337 MC100E337
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol VCUT IIH IEE Characteristic Cut-off Output Voltage1 Input HIGH Current All Other Inputs Power Supply Current 10E 100E 145 145 min - 2.10 typ max - 2.03 150 174 174 145 145 min - 2.10 25C typ max - 2.03 150 174 174 145 167 min - 2.10 85C typ max - 2.03 150 mA 174 200 Unit V A Condition
1. measured with VTT = -2.10V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL Characteristic Propagation Delay to Output Clk to Q Clk to BUS ABUSDIS SYNCEN Setup Time BUS SBUSEN Data, S-IN TEN, REN, SCAN Hold TIme BUS SBUSEN Data, S-IN TEN, REN, SCAN Minimum Pulse Width CLk Rise/Fall Times 20 - 80% (Qn) 20 - 80% (BUSn Rise) 20 - 80% (BUSn Fall) min 450 800 500 800 350 100 400 550 350 500 350 200 400 300 500 300 800 1000 800 typ max 1000 1800 1500 1800 min 450 800 500 800 350 100 400 550 350 500 350 200 400 300 500 300 800 1000 800 25C typ max 1000 1800 1500 1800 min 450 800 500 800 350 100 400 550 ps 350 500 350 200 ps 400 ps 300 500 300 800 1000 800 85C typ max 1000 1800 1500 1800 ps Unit ps Condition
ts
th
tPW tr tf
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E337 MC100E337
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
MOTOROLA
2-4
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E337 MC100E337
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
ECLinPS and ECLinPS Lite DL140 -- Rev 4 2-5
*MC10E337/D*
MC10E337/D MOTOROLA


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